Mechanical/Thermal Principal Design Engineer

Micron Technology Inc is seeking a Mechanical/Thermal Principal Design Engineer to provide technical leadership for the mechanical and thermal architecture of advanced hardware platforms supporting memory and AI computing. The role is based in Boise, Idaho (onsite) and involves end-to-end ownership of design, analysis, validation, and release efforts across multidisciplinary, global teams.

Responsibilities

• Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems, modules, and emerging memory technologies.
• Develop cooling approaches for high-performance platforms, including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling technologies.
• Define mechanical, thermal, reliability, and manufacturability requirements aligned to product performance, quality, and customer objectives.
• Lead thermal CFD and mechanical FEA analyses to optimize performance, reliability, cost, and design efficiency.
• Build and execute validation strategies, including thermal characterization, shock and vibration testing, thermal cycling, humidity testing, DFMEA, derating analysis, and reliability assessments.
• Drive design reviews, risk assessments, root cause investigations, and corrective actions across the product lifecycle.
• Collaborate with electrical, package, PCB, system, manufacturing, and reliability teams to deliver optimized and manufacturable mechanical and thermal solutions while contributing to JEDEC and industry standards development.
• Mentor engineers, set engineering guidelines, act as mechanical and thermal domain expert across multiple programs, and champion AI-enabled engineering workflows to improve simulation, design optimization, validation, and productivity.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering (or equivalent experience), with 7+ years of mechanical and thermal engineering experience.
• 7+ years experience in the electronics, storage, or semiconductor industry.
• Demonstrated track record architecting, developing, and delivering mechanical and thermal solutions for product development and customer applications.
• Strong proficiency with SolidWorks, thermal modeling, and thermal CFD simulation tools such as ANSYS Icepak, ANSYS Fluent, or similar platforms, including AI-enabled design and validation workflows.
• Hands-on experience in thermal management technologies including heatsinks, thermal interface materials, vapor chambers, heat pipes, and liquid cooling, plus thermal/mechanical testing, validation, and failure analysis.
• Deep understanding of mechanical design principles, heat transfer, fluid dynamics, GD&T, tolerance analysis, DFM/DFA, product qualification methodologies, and technical leadership across multi-functional teams.

Technologies

• SolidWorks
• ANSYS Icepak
• ANSYS Fluent
• CFD simulation tools
• Thermal modeling
• Thermal CFD
• Mechanical FEA
• GD&T
• DFMEA
• DFM/DFA

Preferred Qualifications

• Experience with DDR, LPDDR, PCIe, HBM, memory modules, storage subsystems, and AI accelerator platforms.
• Solid understanding of JEDEC standards and data center/server hardware architectures.
• Expertise in advanced thermal and cooling technologies for AI and high-performance computing (HPC) environments.
• Familiarity with finite element analysis (FEA), mechanical reliability modeling, and product performance optimization.
• Proven ability to collaborate with global suppliers and manufacturing partners, with evidence such as patents, publications, or significant technical contributions.