EngineerJobs.io
← Back to all jobs

Job Description

PTEC Solutions Inc. is hiring an onsite PCB Layout Engineer in Maynard, MA to support optical communication product layout from board through package substrate.

Responsibilities

  • Contribute to or lead development of PCB and package substrate layout for leading-edge optical communication products
  • Ensure layout work aligns with IPC standards, company design practices, and fabrication capabilities
  • Collaborate cross-functionally with teams covering electrical, mechanical, thermal, signal integrity, power integrity, and manufacturing
  • Partner with PCB fabricators and substrate vendors to close DFMs (design for manufacturing)

Requirements

  • Bachelor’s degree or equivalent certifications, plus 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering
  • Expert-level proficiency with Cadence Allegro PCB design tools
  • Demonstrated working experience delivering complex high-density, high-speed PCB and substrate designs using advanced HDI and packaging approaches, including stacked micro-vias, sequential lamination, and fine-pitch BGA technologies
  • Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages
  • Working understanding of transmission line layout geometries and rules such as microstrip, stripline, and CPW
  • Demonstrated experience laying out compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
  • Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances
  • Proven success delivering high-volume, high-reliability communication products under aggressive schedules

Technologies

  • Cadence Allegro PCB design tools
  • mSAP PCB layout design
  • Cadence SiP tools

Highly Desired Skills

  • Demonstrated experience with mSAP PCB layout design
  • Demonstrated experience with layout design for state-of-the-art optical pluggable products: CFP2, QSFP-DD, OSFP
  • Proficiency in Cadence SiP tools and substrate layout techniques
  • Proficiency in layouts including wire bond components
  • Strong understanding of PCB fabrication and assembly processes
  • Strong knowledge of relevant industry standards including IPC Class 2/3 and JEDEC

Job Details

  • Job type: Full-time
  • Work location: In person (Maynard, MA)
  • Salary: USD 130,000 to 150,000 per year
  • Experience: Minimum 10 years

Benefits

  • 401(k)
  • Dental insurance
  • Health insurance

Similar Jobs