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Job Description

Northrop Grumman is seeking a Thermal Analysis Engineer to support mission systems through electronics thermal management and thermal analysis or design across airborne, ground, and naval applications. This role is based out of the Baltimore area, with daily onsite work in Linthicum, MD, and requires a US Government Secret clearance to start.

Location, Schedule, and Travel

  • Location: Baltimore, MD (onsite)
  • Work schedule: 9/80 Work Schedule (where available)
  • Travel: Yes, 10% of the time

Salary Range

USD 87,600 - 131,400 per yearly (primary level salary range).

Responsibilities

  • Design advanced electronics thermal management solutions using heat transfer principles to optimize thermal performance.
  • Conduct electronics thermal analysis with experience in heat transfer, including liquid cooled, air-cooled, two-phase flow, and refrigeration thermal solutions for mission systems platforms such as airborne, ground based, and naval applications.
  • Own thermal requirements, thermal architecture, and thermal performance to lead thermal designs, and mentor less experienced thermal engineers.
  • Deliver oral and written presentations to internal and external customers and stakeholders.

Required Qualifications

  • Bachelor’s degree with 2 years of experience, or Master’s degree with 0 years of experience; 4 additional years of experience may be considered in lieu of a degree.
  • U.S. citizenship required.
  • Ability to obtain and maintain a US Government Secret security clearance.
  • Ability to work onsite daily at the Linthicum, MD (Baltimore area) facility.
  • A current or active clearance is not required to be considered, but a final clearance is required to start.
  • 2 years of electronics design experience with emphasis on thermal analysis and optimization of mission-critical electronics systems (for example: airborne, ground, or maritime platforms).
  • 2 years applying thermal engineering principles to challenging air cooled, liquid cooled, and conduction cooled hardware in high power density environments.

Thermal Analysis Tools and Technologies

  • ANSYS Icepak
  • ANSYS Thermal Desktop
  • ANSYS Fluent

Clearance Requirements

  • Clearance required for start: Yes
  • Clearance type: Secret

Preferred Qualifications

  • Active DoD Secret (or higher) security clearance.
  • Advanced degree in Mechanical or Aerospace Engineering with a concentration in Heat Transfer and Fluid Dynamics.
  • Hands-on experience (2+ years) with one or more tools: ANSYS Icepak, ANSYS Thermal Desktop, ANSYS Fluent, or similar electronics cooling or thermal analysis codes.
  • 2+ years leading end-to-end thermal design of hardware for defense platforms (airborne, ground mobile, ground stationary, or naval), from requirements definition through verification.
  • Proven experience advising programs on system-level thermal trades and collaborating within multidisciplinary teams (systems, mechanical, RF, electrical, reliability) from concept through detailed design.
  • 2+ years designing hardware to meet transient thermal conditions.
  • Experience advancing next-generation electronics thermal management solutions (for example: high heat-flux interfaces, two-phase or advanced convective cooling, compact high-power electronics).
  • Knowledge of advanced convective and two-phase thermal management for high heat-flux or high power-density applications, including analytical, high-fidelity numerical, and experimental methods.
  • Prior experience leading thermal design at multiple levels of integration (system, chassis, CCA, and microelectronics) for defense or aerospace hardware.
  • Experience planning and executing thermal design verification testing, including correlation of analysis to test data and updating models based on results.

Benefits

  • Health Plan
  • Savings Plan
  • Paid Time Off
  • Additional benefits including Education Assistance
  • Training and Development
  • 9/80 Work Schedule (where available)
  • Overtime (depending on the position)
  • Shift differential (depending on the position)
  • Discretionary bonus in addition to base pay (depending on the position)
  • Annual bonuses
  • Long Term Incentives (employees in Vice President or Director positions may be eligible)
  • Company paid holidays
  • PTO for vacation and/or personal business
  • Health insurance coverage
  • Life and disability insurance

Relocation Assistance

Relocation assistance may be available.

Application Timeline

The application period for the job is estimated to be 20 days from the job posting date.

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