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Job Description

Role focused on semiconductor product operations for Google's Raxium, with emphasis on engineering changes, MES/PLM workflows, data analytics, and material coordination to support post-wafer processing and assembly in a state-of-the-art fab.

Location: Fremont, CA onsite. Compensation: USD 120,000 – 172,000 per year, plus a 15% target bonus, equity, and benefits.

Responsibilities

  • Product Operations and Change Execution: provide clear technical guidance to Production Control and Logistics on product operations and engineering changes, ensuring engineering intent translates into actionable workflows for manufacturing technicians.
  • Requirement Translation: lead cross-functional coordination to convert technical requirements into concrete steps for OSPT and builds.
  • Business Process Optimization: standardize MES workflows to improve efficiency across process flows.
  • Material Coordination and Strategic Alignment: oversee material movement, coordinate with Production Control and Logistics to maintain smooth flow through thinning, dicing, and assembly; engage vendors as needed.
  • Data Analytics and Insights: extract and synthesize MES and JMP data to build real-time dashboards tracking OSPT cycle time and overall performance.

Requirements

  • Bachelor's degree in Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or Mechanical Engineering, or equivalent practical experience.
  • Minimum five years of semiconductor manufacturing experience, with a focus on post-wafer processing, dicing, or sub-assembly builds.

Technologies

  • SQL
  • Python
  • JMP
  • Tableau
  • MES
  • PLM

About the job

Raxium's display group has established semiconductor materials display technology that enables new functionality in display products, delivering a closer linkage between the digital and physical realms in applications such as augmented reality and light-field displays. With startup roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium aims to expand its engineering team to disrupt next-generation hardware experiences. Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US compensation ranges from USD 120,000 to USD 172,000 per year, plus a 15% target bonus, equity, and benefits.

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