Rf Design

Rf Design Engineer Jobs

27 jobs found

1d ago

Principal RF Design Engineer

Raytheon Marlborough, MA

Marlborough, MA

1d ago

$108k - $205k/yr Full time Electrical Engineering Senior Analog Design

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Job Description

Raytheon seeks a Principal RF Design Engineer to lead the design and development of RF transmitters, receivers, or exciters for radar systems. The role integrates RF circuit design, simulation, and production support to ensure reliable hardware from development through production. This 1st shift position is 100 percent on-site and based in Marlborough, MA or Tewksbury, MA.

Responsibilities

Design and development of transmitters, receivers, or exciters.
Design and optimization of RF circuits, including chains of components (receiver, exciter, etc.) or individual parts such as filters, limiters, and couplers.
Collaborate with interdisciplinary teams including power, digital, and mechanical engineering.
Schematic capture and RF routing.
Provide technical support during transition to production and support production activities.
Position is a first shift, on-site role based in Marlborough, MA or Tewksbury, MA.

Requirements

A degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of relevant experience.
Experience with microwave and RF system, subsystem, and/or component analysis, design and/or test.
Experience with electromagnetic simulation tools such as HFSS, ADS, CST, and Mentor Graphics Xpedition, as well as analytical tools like MATLAB.
Ability to obtain and maintain a U.S. government issued Secret security clearance; U.S. citizenship is required for clearance eligibility.

Technologies

HFSS
ADS
CST
Mentor Graphics Xpedition
MATLAB

Compensation

Salary range is USD 107,500 to 204,500 per year.

Benefits

Relocation assistance based on candidate eligibility
Medical insurance
Dental insurance
Vision insurance
Life insurance
Short-term disability
Long-term disability
401(k) match
Flexible spending accounts
Flexible work schedules
Employee Assistance Program
Employee Scholar Program
Parental leave
Paid time off
Holidays
Annual short-term and long-term incentive programs

What We Offer

RTX values guide actions, behaviors, and performance with a vision of a safer, more connected world. Core values include Safety, Trust, Respect, Accountability, Collaboration, and Innovation. This position also offers relocation support based on candidate eligibility.

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Onsite: Employees in Onsite roles will work primarily on site.

Clearance Information: This position requires a security clearance. The clearance process is handled by the DCSA Consolidated Adjudication Services (DCSA CAS). More information about security clearances is available at the U.S. Department of State website.

Privacy Policy and Terms

Click on this link to read the Policy and Terms

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1d ago

RF Antenna and Radome Engineer II

Raytheon Tucson, AZ

Tucson, AZ

1d ago

$69k - $131k/yr Full time Electrical Engineering Antenna Analysis Design Engineering

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Job Description

_raytheon is seeking an RF Antenna and Radome Engineer II to join its Effector RF Design Department in Tucson, AZ. This onsite role focuses on antenna and radome hardware development, modeling and simulation, and interpretation of test data, working with cross-functional teams to meet rigorous performance requirements. The position blends hands-on design with analysis, requiring collaboration with thermal, structural, mechanical, and systems engineers as well as antenna manufacturing suppliers._

Responsibilities

Development of antenna or radome hardware and requirements.
Collaborate with interdisciplinary engineering teams including thermal, structural, mechanical, and systems engineering.
Engage with antenna manufacturing suppliers.
Conduct antenna modeling and simulation on workstations and high performance computing resources.
Interpret simulation or measurement test data to verify performance against requirements.

Requirements

Master’s degree in Electrical Engineering or Computer Engineering or related STEM field.
Experience and/or coursework with RF and electromagnetic theory.
Proficiency with modeling and simulation tools such as HFSS, CST, FEKO, SENTRi and/or GRASP.

Technologies

HFSS
CST
FEKO
SENTRi
GRASP
Python
MATLAB

Location

United States, Tucson, AZ (onsite). Onsite role at 1151 E Hermans Rd, Building M02.

Salary

USD 68,900 - 131,100 per year.

Work Type

Onsite

Security Clearance

Active and transferable U.S. government issued security clearance required prior to start date.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.
DoD Clearance: Secret; Interim clearance required prior to start date.

Benefits

RTX values guide actions, behaviors, and performance with a vision for a safer, more connected world. The company emphasizes Trust, Respect, Accountability, Collaboration, and Innovation, and offers relocation eligibility for eligible candidates.

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3d ago

Principal PCB & Substrate Layout Engineer

Belcan Phoenix, AZ

Phoenix, AZ

3d ago

$98 - $98/hr Contract Electrical Engineering Senior Design

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Job Description

Belcan is seeking a Principal PCB & Substrate Layout Engineer to provide technical leadership in high-speed interfaces and dense substrate layout for defense and aerospace microelectronics. This onsite Phoenix contract role calls for a Bachelor’s degree in engineering and at least ten years of hands-on PCB and HDI layout experience, with a focus on multi-die packaging and flip-chip implementations. The right candidate will guide complex designs from concept through fabrication, delivering robust PCBs and substrates that meet stringent military and aerospace standards.

Responsibilities

Lead the design, layout, and analysis of intricate electrical and mechanical systems, including high-density interposers, substrates, and multi-layer PCBs, handling power, digital, analog, and RF signals across multiple dies with a primary emphasis on flip-chip configurations.
Perform hands-on work on high-speed, multi-layer packaging and HDI interconnects, including blind and buried vias, BGAs, RF sections, design for test, impedance calculations, crosstalk, differential pairs, stack-ups, vias, EMC, and material studies/selection.
Ensure designs follow supplier design-for-manufacturing rules and align processes with supplier capabilities.
Prepare fabrication drawings that reflect design intent and support seamless transfer to fabrication suppliers.
Support package material characterization with frequency-dependent models, including skin effects, surface finish, roughness, dielectric loss, and dielectric constant.
Collaborate with peers to review artwork and drawings at various stages and participate in final design reviews for fabrication and assembly.
Support multidisciplinary investigations and feasibility studies across engineering disciplines.
Provide technical guidance interfacing with customers, subcontractors, assemblers, fabricators, vendors, operations, quality, supply chain, and supporting organizations.
Tackle complex issues that require in-depth analysis of variable factors and apply systems thinking to evaluate the impact on the overall system.
Contribute across disciplines to help the team achieve goals and deliverables.

Requirements

Bachelor’s Degree in Engineering or equivalent education and experience.
10+ years of PCB and/or High-Density Package Layout design experience using industry-standard tools such as Cadence APD+.
Proficiency with APD+ physical and electrical constraint editor.
Experience with HDI stack-ups, including blind and buried microvias, RF dielectric materials, and trace widths/spacings from approximately 15 μm down to 2 μm or smaller.
Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, and substrate stacking techniques.
Experience using a Cadence schematic/netlist-driven CAD layout process (APD+/Allegro) and supporting tools.
High-end FPGA package or board design experience.
Ability to collaborate with the Mechanical team to develop full 3D models for fit checks and thermal analysis.
Understanding of layout techniques for digital, analog, and RF designs.
Knowledge of electronic packaging techniques.
Experience using a CAM package for manufacturing data validation; familiarity with CAM350 and Blueprint is preferred.
Working knowledge of JEDEC/IPC design, fabrication, and assembly specifications.
Experience creating assembly documentation and fabrication deliverables per company and industry standards.
Must be a US Person.
Ability to work effectively both independently and as part of a team.
Commitment to teamwork, execution, and clear communication as part of the company culture.

Technologies

Cadence APD+ (Allegro)
APD+ physical and electrical constraint editor
CAM 350
Blueprint

Benefits

Health care
Dental
Vision
Life insurance
401(k)
Education assistance
Paid time off including PTO, holidays, and legally required paid leave

You will be a part of

You will join a team focused on the rapid development of affordable, chip-scale, secure, open system architecture devices. This cutting-edge capability supports the Department of Defense need for made-in-USA microelectronics that equip warfighters with state-of-the-art, trusted military-grade products built on leading commercial technologies.

To succeed in this role, you should have the following skills and experience

Bachelor’s Degree in Engineering or equivalent education and experience.
10+ years of PCB and/or High-Density Package Layout design experience using Cadence APD+ or equivalent tools.
Experience with APD+ physical and electrical constraint editor.
HDI stack-ups including blind and buried microvias, RF dielectric materials, and fine trace widths/spacing down to 2 μm or smaller.
Experience with 2.5D devices, interposer/substrate design, flip-chip, die stacking, and related techniques.
Cadence schematic/netlist-driven CAD layout workflow experience.
High-end FPGA packaging or board design experience.
Ability to work with Mechanical teams to create 3D models for fit and thermal checks.
Understanding of digital, analog, and RF layout techniques.
Knowledge of electronic packaging techniques.
Experience using CAM packages for manufacturing data validation; CAM350 and Blueprint familiarity preferred.
Working knowledge of JEDEC/IPC design, fabrication, and assembly specifications.
Experience producing assembly documentation and fabrication deliverables per standards.
Must be a US Person.
Ability to work well both independently and within a team, upholding teamwork, execution, and communication values.

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3d ago

Sr. Principal Communications/Co-site Electronics Engineer

Northrop Grumman Melbourne, FL

Melbourne, FL

3d ago

$123k - $184k/yr Full time Electrical Engineering Senior Antenna Analysis

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Job Description

Northrop Grumman is seeking a Sr. Principal Communications/Co-site Electronics Engineer in Melbourne, FL. The role centers on RF subsystem development and integration, requirements management, CEM analysis, testing, and close collaboration with suppliers and program teams. This is an on-site position with a 9/80 schedule, no hybrid or remote work, and travel required up to 10%.

Responsibilities

Support the development and integration of communications and other RF subsystems and components to meet platform mission objectives
Develop requirements, analyze and mature them, translating customer needs into derived specifications
Perform Computational Electromagnetics (CEM) antenna analysis for source and victim (co-site) scenarios
Conduct detailed trade studies to evaluate design options
Execute risk analysis and craft mitigation plans, tracking progress to closure
Collaborate with engineers and program stakeholders across the project lifecycle
Develop and maintain supplier documentation, performance-based specifications, and statements of work
Provide technical management of program strategic partners and suppliers, including development, acquisition, qualification, system integration and test support
Review supplier development documents and participate in technical interchange meetings and design reviews
Identify, plan, and execute informal and formal testing of subsystem requirements in the lab; troubleshoot hardware
Conduct aircraft ground and flight tests on subsystems to validate requirements and achieve sign-off
Engage in technical discussions with the customer and maintain daily interactions with management, external personnel, customers, and sub-teams

Requirements

Senior Principal: a Bachelor's degree in a STEM discipline from an accredited university with 8 years of related professional/military engineering experience, or a Master’s degree in STEM with 6 years of related experience
Knowledge of electromagnetics in the RF spectrum from VHF through Ka bands
Ability to design, select, and characterize RF components to meet mission objectives
Experience with Computational Electromagnetic (CEM) antenna analysis for source/victim co-site analysis
Experience in one or more of the following areas:
- Designing, integrating, testing, installing, and operating LOS and BLOS airborne military communication systems
- Experience with voice, military, and network waveforms
- Cryptographic implementations
Demonstrated problem-solving ability and data analysis skills
Knowledge of systems engineering design methods, including requirements analysis and flow-down, specification derivation, and interface control documentation
Active US Government Secret Clearance (with a background investigation within the past 6 years or enrolled in Continuous Evaluation) and any program access required for the position within a reasonable period, as determined by the company
Ability to obtain and maintain US Government Top Secret clearance

Technologies

Cameo
SysML tools
MATLAB
Excel
Jira
Confluence

Benefits

Health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Paid time off (PTO)
Annual bonuses
Long Term Incentives

Relocation Assistance

Relocation assistance may be available

Clearance Required for Start

Yes

Clearance Type

Secret

Travel

Yes, 10% of the Time

Primary Level Salary Range

$122,800 - $184,200 per year

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3d ago

Software Engineer - Avionics RF Design and Integration

Capgemini Atlanta, GA 🇺🇸 Remote

Atlanta, GA

3d ago

$80k - $160k/yr Full time Avionics DevOps DO-178C

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Job Description

Capgemini is seeking a Software Engineer with a background in safety-critical avionics software for defense and surveillance platforms. The role centers on embedded C++ development with RFIO, strict adherence to DO-178C standards, and flight-test integration.

Responsibilities

Develop embedded avionics software in C++ with a focus on RFIO interfaces and data pathways.
Execute DO-178C compliant software development, with a preference for DAL A where possible.
Create and manage requirements using DOORS, ensuring end-to-end traceability.
Support software certification artifacts, including plans, requirements documents, and traceability matrices.
Conduct code reviews, manage builds, and maintain configuration control across the software lifecycle.
Assist with flight-test integration by interpreting aircraft wiring diagrams and data flows.
Support software testing activities using Python for scripting and test automation.

Requirements

Strong experience with DO-178C and the embedded software development lifecycle.
Proficiency in C and C++, with familiarity of build systems and compiler configurations.
Experience with JIRA, Bitbucket, and configuration management tools.
Familiarity with certification and documentation environments.
Experience related to signal processing, FPGA interfacing (hardware registers), and RFIO.
Proficiency in Python.

Technologies

C/C++, RFIO, DO-178C, DOORS, Python
JIRA, Bitbucket, CM tools

Benefits

Paid time off based on employee grade, including vacation (12–25 days), company holidays, personal days, and sick leave.
Medical, dental, and vision coverage or provincial healthcare coordination for Canada-based roles.
Retirement savings programs such as 401(k) in the United States or RRSP in Canada.
Life and disability insurance coverage.
Employee assistance programs and related wellbeing benefits.
Other benefits offered per local policy and eligibility.

Location

Primary location: Atlanta, GA, with remote work options. Location details indicate additional on-site options in Deer Valley, AZ or Seattle, WA, with potential for remote arrangements.

Compensation

Salary range: USD 79,750 - 159,500 per year.

Important Notice

Compensation, including bonuses or other forms of incentive pay, is not earned or payable until due under applicable plans and agreements and remains at Capgemini's discretion, in compliance with applicable law. The company reserves the right to amend or withdraw compensation programs at any time.

Disclaimers

Capgemini is an Equal Opportunity Employer that promotes inclusion in the workplace. The company participates in the Partnership Accreditation in Indigenous Relations PAIR program to support meaningful engagement with Indigenous communities across Canada, promoting fairness, accessibility, inclusion, and respect. The organization values Indigenous heritage and contributions and strives to foster a welcoming and respectful environment for all applicants.

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3d ago

RF Engineer I

Zebra Technologies Holtsville, NY

Holtsville, NY

3d ago

$68k - $103k/yr Full time Electrical Engineering Design Design Engineering

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Job Description

What Zebra Technologies offers

Join a company that prioritizes balance, growth, and community. Enjoy a hybrid work setup with flexible hours designed to support your workflow, plus programs that promote health, learning, and social impact. You’ll be compensated competitively and have access to resources that foster professional development and well being.

Hybrid work arrangement with adaptable hours
Summer Flex Fridays and Focus Fridays to support focus and recharge
Annual companywide well being day
Healthcare and wellness programs
Inclusion networks and a culture that values diversity
Continued learning and development opportunities
Community service days
Traditional insurances, competitive compensation, and paid time off
Parental leave and employee assistance program

About this role

As an RF Engineer I, you will help develop, design, model, and test RF transmitter and receiver subsystems. You will collaborate across disciplines on multi‑disciplinary radio design activities, with onsite presence required at Holtsville, NY, while enjoying hybrid work options.

Responsibilities

Define requirements for less complex design projects
Complete all phases of RF engineering design projects
Analyze processes and deliver results to stakeholders
Assess results and propose viable solutions
Develop expected results across a range of products
Create documentation for new projects and review prior results
Work with the latest technologies and new approaches
Review changes or upgrades to existing designs or tests
Exercise judgment in selecting methods and techniques to obtain solutions

Requirements

Bachelor of Engineering in Electrical Engineering
Must have completed an Electromagnetics course
Antenna Design course is a strong plus
Familiarity with laboratory measurement techniques
Hands-on project experience

Compensation and benefits

Salary range: USD 68,400 to 102,600 per year
Annual performance based cash incentive up to 5% of base pay
Location: Holtsville, NY with hybrid work option

Total rewards and benefits extend beyond base pay, including healthcare, wellness programs, inclusion networks, ongoing learning and development, community service days, traditional insurances, compensation, parental leave, employee assistance program, and paid time off.

Equal opportunity and rights

Zebra is an equal opportunity employer. All qualified applicants will be considered without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status. For accommodations during the application process, contact workplace.accommodations@zebra.com.

Know your rights

For details on workplace rights, see the EEOC Know Your Rights resources: English version PDF and Spanish version PDF.

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8d ago

Senior Antenna Engineer

Holt Executive Maryland

Maryland

8d ago

$170k - $230k/yr Full time Electrical Engineering Senior Cst

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Job Description

Holt Executive invites seasoned engineers to join our onsite Maryland team as a Senior Antenna Engineer. This role centers on the design, development, and testing of Ku- and Ka-band RF and antenna systems for satellite user terminals, including phased array and AESA technologies, across the full product lifecycle. The position offers a competitive salary range of USD 170,000 to 230,000 per year, along with comprehensive benefits and a collaborative, technically rigorous culture that emphasizes hands-on impact and cross-disciplinary teamwork.

Responsibilities

Design and refine Ku- and Ka-band RF and antenna systems for satellite terminals, featuring phased array and electronically steerable technologies.
Conduct electromagnetic simulations, antenna modeling, optimization, and trade-off analyses using industry-standard tools.
Create antenna design documentation, engineering specifications, and prototype solutions to support manufacturing and product delivery.
Develop and execute RF test plans, configure laboratory environments, characterize antennas, and produce verification reports.
Design and automate RF testing processes using scripting tools and provide troubleshooting support throughout development and validation activities.
Collaborate with multidisciplinary engineering teams and provide technical leadership during design reviews, prototype development, and production ramp-up.
Support AESA antenna development activities, including analysis of beam scanning capability, cross-polarisation, G/T, and EIRP.

Requirements

Bachelor's, Master's, or PhD in Electrical Engineering, Physics, or a related discipline.
A postgraduate qualification with antenna or electromagnetic research experience is highly desirable.
5+ years of experience designing and developing satellite communication antenna systems, including phased array technologies.
Strong knowledge of antenna theory, microwave engineering, RF system architecture, and antenna performance analysis.
Experience using electromagnetic simulation tools such as HFSS, CST, or equivalent.
Hands-on experience with RF test equipment, including signal generators, spectrum analysers, vector network analysers, and antenna measurement systems.
Experience supporting antenna products through prototype development, verification, and manufacturing processes.

Technologies

HFSS
CST

Benefits

Flexible time off and paid holidays
Medical, dental, and vision insurance
Short-term and long-term disability coverage
401(k) plan with employer contributions
Potential annual bonus opportunities based on company and individual performance

Desirable Experience

Experience designing active electronically steerable phased array (AESA) antennas for LEO satellite user terminals.
Knowledge of beamforming technologies, MMIC integration, polarization solutions, radomes, and advanced antenna materials.
Experience with PCB-based radiator technologies, metasurface antennas, and wide-scan-angle antenna designs.
Understanding of manufacturing processes and cost-effective approaches for high-volume antenna production.